| abstract |
The epoxy resin composition according to the invention contains an epoxy resin and/or an epoxy compound, a curing agent, a curing accelerator and an inorganic filler as main components. The inorganic filler has a particle size of a maximum particle diameter of not more than 10 μm and a mean particle diameter of not more than 3 μm and a slope n of not more than 4.0 in its particle size distribution that is expressed by a Rosin-Rammler's (RRS) diagram, and is contained in the resin composition in an amount of not less than 30% by weight and not more than 85% by weight based on the total amount of the resin composition. The slope n is preferably not less than 1.0. The resin composition is preferable for transfer molding or injection molding. This composition is free from deterioration of moldability caused by lowering of flowability and is excellent in mold-transferring properties and excellent dimensional stability. Hence, the composition can provide a precision-molded article having excellent dimensional stability, such as a precision-molded component having a small degree of surface roughness and small circularity. By the use of the resin composition, a precision connector for optical communication, such as a single-core ferrule or a multi-core ferrule, can be produced as resin-made one. Further, the resin composition is excellent in mold-transferring properties and is capable of being injection molded. The precision-molded article according to the invention comprises the resin composition. |