| abstract |
A fabrication method of semiconductor packaging and the packaging element is disclosed. A layer of copper is formed on a thick heat-resistant tape and the surface of the copper layer is coated with a light sensitive photoresist. A light source passes through a pre-fabricated circuit negative being performed on the copper layer such that the photoresist is retained on the surface of the copper layer. An etching step is performed so as to obtain a copper wire with circuit diagram. After that, a wire bonding or a flip chip method is used to bind copper wire circuit with the chip. An appropriate packaging method is performed, a packaging element is obtained after the heat-resistant tape is removed. |