| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-0221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-61 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R43-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R12-61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-20 |
| filingDate |
2001-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74115d295eb2b986f78efe8bddaa1863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8df8235553282b551a552e0c31b44ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_584f5a911efe3f707a49af73ee9845d8 |
| publicationDate |
2003-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003019846-A1 |
| titleOfInvention |
Flex to flex soldering by diode laser |
| abstract |
A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006226199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7009142-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018099766-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10631409-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004112935-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114211074-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005258153-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10206289-B2 |
| priorityDate |
2001-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |