http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003008421-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4efee27937b4a512f45809fed5293747 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 |
| filingDate | 2001-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa3fe990d2d252a0c4390c6e70c1c843 |
| publicationDate | 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2003008421-A1 |
| titleOfInvention | Process for making wafers for ion implantation monitoring |
| abstract | A process is disclosed for making a silicon wafer with low and uniform surface stress by growing at least approximately 8 angstroms of silicon oxide thereon to produce a wafer for use as a control wafer in ion implantation. The process involves the steps of (a) subjecting a feed wafer substantially free of oxide or having less than approximately 4 angstroms of silicon oxide thereon to hydrogen termination of the silicon surface; or (b) subjecting such a feed wafer to said hydrogen termination followed by subjecting the resulting wafer to treatment with an oxidant having a standard reduction potential less than approximately 1.77 volts; the wafer resulting from either step (a) or (b) having a TWO reading less than approximately 30 across the entire wafer. |
| priorityDate | 2001-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.