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publicationDate 2003-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003006478-A1
titleOfInvention Method to fabricate passive components using conductive polymer
abstract A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.
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