| abstract |
A polyamide resin is disclosed. Moldings of the polyamide resin composition are lightweight and have high mechanical strength including high flexural strength and high flexural modulus, as well as good heat resistance, good impact resistance and good metallic appearance. In the polyamide resin composition, the polyamide resin is reinforced with from 0.1 to 10% by weight of a layered silicate uniformly dispersed therein on a molecular level. To 100 parts by weight of the reinforced polyamide resin are added from 0.1 to 10 parts by weight of particles capable of expressing a metallic color. |