| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2001-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_368e8ce6aa211f02a7767307ccecc204 |
| publicationDate |
2002-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002167804-A1 |
| titleOfInvention |
Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging |
| abstract |
An encapsulation material for use within a microelectronic device includes a polymeric base resin that is filled with a fibrous reinforcement material. The fiber reinforcement of the encapsulation material provides an enhanced level of crack resistance within a microelectronic device to improve the reliability of the device. In one embodiment, a fiber reinforced encapsulation material is used to fix a microelectronic die within a package core to form a die/core assembly upon which one or more metallization layers can be built. By reducing or eliminating the likelihood of cracks within the encapsulation material of the die/core assembly, the possibility of electrical failure within the microelectronic device (e.g., within the build up metallization layers) is also reduced. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9321245-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013256922-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8011950-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013292715-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8906749-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8994040-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014197436-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4187589-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9178124-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016317068-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009168380-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8298009-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103367174-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8337243-B2 |
| priorityDate |
2001-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |