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filingDate 2002-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35f8b8c474e0f1882b898f8959fb67af
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publicationDate 2002-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002143132-A1
titleOfInvention Silsesquioxane polymer molding and method of preparing same
abstract A molding obtained by heating a hydrosilylated polymer at a temperature higher than the softening point or melting point thereof. The hydrosilylated polymer is obtained by reacting at least one hydridosilsesquioxane compound of the following formula (1): n (HSiO 3/2 ) n   (1) n wherein n is an integer of 4-1000, with at least one divinylsiloxane compound of the following formula (2): n CH 2 ═CH—SiR 2 —O—(SiR 2 .O) q —(SiR′ 2 .O) q ′—SiR 2 —CH═CH 2   (2) n wherein R and R′ are independently selected from alkyl groups, substituted alkyl groups, aryl groups and substituted aryl groups, and q and q′ are each an integer of 0 or more.
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