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filingDate 2002-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d4afdd04f708a88242c5e37b3ed2ef4
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publicationDate 2002-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002135077-A1
titleOfInvention Semiconductor copper bond pad surface protection
abstract Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
priorityDate 1998-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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