| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31721 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate |
2002-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f912a1a5acd1fd911180f630af79bbc9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16512b47ad4572d7ebd227109954784b |
| publicationDate |
2002-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002132095-A1 |
| titleOfInvention |
Resin composition for wiring circuit board, substrate for wiring circuit board, and wiring circuit board |
| abstract |
The present invention provides a resin composition for a wiring circuit board; a substrate for a wiring circuit board in which a base insulating layer has been formed from the resin composition for a wiring circuit board; and a wiring circuit board having insulating layers including a cover insulating layer formed from the resin composition for a wiring circuit board. The resin composition for a wiring circuit board, the substrate for a wiring circuit board, and the wiring circuit board can prevent warpage and curling, increase adhesion between the insulating layer and the conductor layer, and enhance the durability and reliability of the wiring circuit board. The resin composition for a wiring circuit board contains a polyimide resin precursor, and a polyhydric phenol compound. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2172524-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7632622-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005161775-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10179828-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015309600-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010201802-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7084493-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007003863-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2172524-A1 |
| priorityDate |
2001-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |