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filingDate 2001-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2942a3df4f75a19570976cfb3e1138e4
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publicationDate 2002-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002130033-A1
titleOfInvention Process for metal plating liquid crystalline polymers and compositions related thereto
abstract Liquid crystalline polymers (LCP) may be sputter-coated or ion-plated with palladium to yield palladium coated LCP parts. These may be electrolytically plated, as with copper, using normal or unusually high current densities, to make metal plated LCP in which the metal has good adhesion to the LCPs. Before or after the electrolytic plating, the metal coating may be patterned. Parts containing patterned metal surface may be used as circuit boards or printed wire boards.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008239208-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006010862-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013011072-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7820921-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6933013-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005035834-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005035834-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8394469-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014023881-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009152003-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8801964-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10053769-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005079281-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7639319-B2
priorityDate 1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 49.