| abstract |
The present invention is to provide a method of forming a multilayer coating film by which the multilayer coating film comparable in shock resistance, in particular chipping resistance, to the conventional three-coat films can be formed in the three-wet one-bake coating system which is intended for coating process curtailment, cost reduction and environmental impact reduction. n The present invention provides a method of forming a multilayer coating film comprising the step (I) of coating an article to be coated with an electrodeposition coating followed by curing by heating to form an electrodeposited coating film, the step (II) of applying a water-borne intermediate coating onto said electrodeposited coating film to form an uncured intermediate coating film, the step (III) of applying a water-borne base coating onto said intermediate coating film to form an uncured base coating film, the step (IV) of applying a clear coating onto said base coating film to form an uncured clear coating film and the step (V) of curing said intermediate coating film, said base coating film and said clear coating film simultaneously by heating to thereby obtain a multilayer coating film. |