| abstract |
The present invention relates to a process for bonding two or more wood substrates by using as the adhesive isocyanate-terminated prepolymers having an isocyanate content of 8 to 20 wt. % and containing the reaction product of n a) at least one organic polyisocyanate with n b) at least one organic polyhydroxyl compound containing the reaction products of n i) organic polyisocyanates with n ii) polyamines, hydrazines and/or hydrazides having primary and/or secondary amino groups dispersed in a n iii) polyethers having at least two hydroxyl groups and a number average molecular weight of 500 to 12,000. n The present invention also relates to the bonded substrates obtained by this process. |