| abstract |
An organometallic copper complex having the following formula is favorably employable for preparing copper metal film by chemical vapor deposition: n n n [R 1 and R 2 each is alkyl or perfluoroalkyl; R 3 is hydrogen, fluorine, or perfluoroalkyl; and at least one of R 4 -R 7 is a group having the formula: n n n (in which R a is alkylene, R b , R c , and R d each is alkyl group, and M is oxygen or sulfur, and each of the remainders is hydrogen or alkyl)]. |