| abstract |
An electronic device package comprises a substrate, a die, and a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In one embodiment, the package utilizes a material having a Young's modulus of between about 0.1 megapascals and about 20 megapascals (at a solder reflow temperature) for attaching the die to the substrate. In an alternate embodiment, the package utilizes a material having a coefficient of thermal expansion α 2 of less than about 400 (four-hundred) ppm (parts per million)/° C. for attaching the die to the substrate. In another alternate embodiment, the package utilizes a rigid material for attaching the die to the substrate. |