| abstract |
An interconnect assembly and a fluxless method for forming the interconnect assembly. The fluxless method includes providing a first semiconductor substrate having a first pad connected thereto. A post is connected to the first pad and includes a length greater than a thickness of the first pad, and a metallic solder disposed on an associated end of the post. A second semiconductor substrate is provided as having a second pad connected thereto. The fluxless method further includes depositing an unfilled polymeric liquid on the second pad, aligning and contacting the metallic solder with the unfilled polymeric liquid, and forcing by pressure the first and second semiconductor substrate toward each while simultaneously heating the metallic solder and the unfilled polymeric liquid to form a metallurgical joint between the second pad and the metallic solder. |