http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002084193-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
filingDate 2001-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d5061457067611c7ad6007faad75a3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbd6ba40b473e33c5ab825de9bc74e23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7e680c7271cae0f7b5c252c58ac7081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b96e82003b1604c05f5b940692af0e76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07d5f51c916ee7062cccfa7107a408db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_585e8d18329d0374edb0759df55d2f19
publicationDate 2002-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002084193-A1
titleOfInvention Seed layer
abstract Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010080227-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010170638-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003221969-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8262894-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8088246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019066900-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7429401-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1479793-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2385881-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009174077-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1479793-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7905994-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007178697-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7928011-B2
priorityDate 2000-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451398592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451154338
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6328722
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457582651
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128686004
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID422086467
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128783746
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127901356
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129577721
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452327997
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18616
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22892188
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454066690
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419509268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23938
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453318015
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452787860
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21902446
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24489
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2801741
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID136165385
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410060652
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10692
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2723699
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID136168220
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129621877
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID323
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454626951
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID78938
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID87206
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449150624
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57230348
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449355117
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10999
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127795615
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24846
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2723889
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450155238
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559577
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57228701
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID86469
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24463
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451363760
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID128074315
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411832067
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28123
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID170058
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID87838
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129221991
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69023
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28118
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6328035
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421462566
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164180829
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127397855
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449412871
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8895
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449324567
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID416200652
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3613496
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12130753
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID160765
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2723650
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID424634738
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451403949
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451547506
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20722760
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID127849049
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450108871
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6451521
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7516
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457630696
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419589109
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447669256
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452378154
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415783955

Total number of triples: 123.