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filingDate 2000-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2002-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002071961-A1
titleOfInvention Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components
abstract A material for an electronic component having a plating layer A formed of metals X and Y mixed with each other on a base metal material and a coating layer B formed of the metal X provided on the plating layer A is provided, whereby wettability of soldering is satisfactory ensured, degradation of solderability and appearance is prevented and generation of whiskers can also be prevented.
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