| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09518 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-421 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b3242163a845860575bafdeee500298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98611796e762fe24e1d1ef7f4f8a7be5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ce25e34eaa05f662d9626ecd9e7e0d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc72e2c3a5bdd74f8616a4a3c3e9b660
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0f961f0a1fe69cf0408aa90c6bc7456
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cf0f09c3d85a871fe85ce835832329d |
| publicationDate |
2002-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002064947-A1 |
| titleOfInvention |
Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor |
| abstract |
Providing a multilayer wiring substrate high in connection reliability through process steps of forming more than one opening such as a via-hole in a dielectric layer laminated on a substrate and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. n An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative way of performing such electroless copper plating is to make use of an electroless copper plating solution with chosen additive agents or “admixtures” containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2′-bipyridyl, 1,10′-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6962875-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008135981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018342473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10405422-B2 |
| priorityDate |
2000-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |