| abstract |
A submount and a method for making the submount, is described. A substrate has a channel formed therein. An insulator material, such as a dielectric material, is deposited on the substrate within the channel and on an upper surface of the substrate. A conductive material is deposited over the dielectric material. Preferably, the conductive material within the boundaries of the channel should be lower than the upper surface. The substrate is then planarized, which eliminates the conductive material and the dielectric material from outside the boundaries of the channel. Alternatively, an electric ground plate can be formed by doping a region of the substrate surrounding the channel or by depositing a second conductive material prior to laying down the dielectric material. Optionally, a second dielectric material may be positioned over the conductive material, and after planarization a conductive material may be deposited and patterned thereon. |