http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002053315-A1

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61K31-675
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filingDate 2001-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48bab53d7a42ee70236db1e75f0de189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_408eed0030daf4a7288635270deb4112
publicationDate 2002-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2002053315-A1
titleOfInvention Process for preparing low defect density silicon using high growth rates
abstract The present invention relates to a process for growing a single crystal silicon ingot which contains an axially symmetric region which is substantially free of agglomerated intrinsic point defects. The process comprises (i) forming a region within the constant diameter portion in which vacancies are the predominant intrinsic point defect; (ii) heating the lateral surface of the ingot to cause a thermally induced inward flux of silicon self interstitial atoms into the region from the heated surface which reduces the concentration of vacancies in the region; and (iii) maintaining the temperature of the region in excess of the temperature, T A , at which agglomeration of vacancy point defects into agglomerated defects occurs during the period of time between the formation of the region and the reduction of the concentration of vacancies in the region.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013112779-A1
priorityDate 2000-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 33.