| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b85bdd879b15a12219eeb0f7a8136111 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
| filingDate |
2001-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_802d674e1184ac854ae5a1457c357590 |
| publicationDate |
2002-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002051353-A1 |
| titleOfInvention |
High-frequency ceramic package |
| abstract |
A high-frequency ceramic package 10 comprises a ceramic frame plate 12 brazed to a jointed metal plate 11 on the surface thereof, the jointed metal plate 11 including a substantially rectangular shaped first metal plate 17 which has a hollowed portion 19 at a central portion thereof and a second metal plate 18 which is fitted in the hollowed portion 19 in a state in which the first and second metal plate 17, 18 are jointed together in end-to-end relationship. The first metal 17 is close to the ceramic frame plate in thermal expansion coefficient, and the second metal plate 18 is made from a material having a high level of heat-sinking characteristics. A concave cavity 16 defined between the second metal plate 18 and the ceramic frame plate 12 has a semiconductor electronic component mounting portion on a bottom 16 a of the cavity 16. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012306086-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020004801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886198-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020131308-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10720379-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11437296-B2 |
| priorityDate |
2000-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |