| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_69bddb4c84704857f70d926c31a6e1a2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K9-0039 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K9-00 |
| filingDate |
2001-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3b8e65f805d7d8c62b46a6628e7d95e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4743af2f8cbcb774099670f872f681c3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3562ffaaddb736d4b2244aee3a4eb0f |
| publicationDate |
2002-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002050401-A1 |
| titleOfInvention |
Integrated EMI shield utilizing a hybrid edge |
| abstract |
The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, an IC chip carrier comprises an insulating ceramic substrate and at least one internal electrically conductive layer being a circuit ground, portions of which extend to the edge of the substrate, the internal electrically conductive layer in electrical contact with an electrically conductive layer applied to a portion of the substrate edge. This provides a horizontal hybrid ground plane which can be used as an EMI shield that runs horizontally to the chip as well as a hybrid edge EMI shield perpendicular along at least a portion of the edge. This edge shield protects internal circuitry from exterior EMI emissions directed towards the chip carrier edge portion incorporating the shield. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010211123-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8886317-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8014867-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8543207-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8032228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010087892-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8977356-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8160717-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8311637-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8554335-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9381371-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8571661-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8086321-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8897875-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9561378-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8639331-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8565874-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009138058-A1 |
| priorityDate |
1999-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |