| abstract |
A polypropylene-based resin film of a resin composition (C) comprising: n 40 to 95 wt % of a propylene-based copolymer (A) selected from a propylene random copolymer (i) of propylene with ethylene and/or α-olefin and a propylene-based copolymer (ii) composed of 1 to 30 wt % of a component (a) obtained by copolymerizing propylene, an α-olefin and ethylene in a first step; and 70 to 99 wt % of a component (b) obtained by copolymerizing those in the subsequent step, in which the copolymerization ratio is different from that in the first step; and n 5 to 60 wt % of a polypropylene-ethylene and/or α-olefin block copolymer (B) having a CXS of 5.0 wt % or more, wherein the CXS has a content of ethylene and/or the α-olefin of 14 to 35 mol %, and wherein the heat-seal temperature of the film of the (C) is lower by 3° C. or more than those of respective films of the (A) and (B). |