patent/US-2002033531-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002033531-A1

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filingDate	2001-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0763351684180d03ff87a80394413494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c6edae0981e41fb17111ef790aa7c77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa4ade2ea619f66b12ce1acc929418d5
publicationDate	2002-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2002033531-A1
titleOfInvention	Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
abstract	A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.
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priorityDate	2000-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 97.