| abstract |
A thermally conductive silicone rubber composition comprising (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler surface treated with (D) a silalkylene oligosiloxane described by formula n n n where R 1 is a monovalent hydrocarbon group comprising at least 2 carbon atoms that does not have aliphatic unsaturated bonds, each R 2 is an independently selected monovalent hydrocarbon group comprising 1 to 10 carbon atoms that does not have aliphatic unsaturated bonds, R 3 is an alkylene group comprising at least 2 carbon atoms, R 4 is an alkyl group, subscript a is an integer of 0 to 2 and subscript b is an integer of 1 to 3, with the proviso that a+b is an integer of 1 to 3, subscript c is an integer of 1 to 3, and subscript n is an integer of 0 or 1. The thermally conductive filler may be treated with component (D) prior to addition to the present composition or may be treated in situ. |