patent/US-2002008320-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002008320-A1

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filingDate	2001-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c736e7df66afe93f2da42c6d66abc69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cb132cc1fc77fe0a0f4995636c2f7d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36e313cc9ddfbcd456046293522390a2
publicationDate	2002-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2002008320-A1
titleOfInvention	Semiconductor device and method of making the same, circuit board and electronic equipment
abstract	A method of manufacturing a semiconductor device comprising a step of forming a plurality of resin layers, an interconnect connected electrically to an electrode of each of a plurality of semiconductor elements, and an external terminal connected electrically to the interconnect, on an aggregate of semiconductor elements having an electrode, and a step of cutting the aggregate, wherein at least one resin layer among the plurality of resin layers is formed avoiding a cutting region of the aggregate.
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type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 111.