| abstract |
Certain polyamide molding compositions are disclosed having improved flame resistance and heat stability. These compositions comprise in weight percent, 20-78% polyamide having a melting point of 280-340° C.; 10-60% inorganic filler; 10-35% flame retardant (brominated or chlorinated); 1-10% antimony compound; 1-10% of one or more oxides, hydroxides, or salts of weak mineral acids, and combinations thereof; and 0-2% heat stabilizer. |