| abstract |
A substrate dryer causing no water mark on a substrate having a refined·complicated structure and capable of suppressing increase of a cost required for a drying treatment is provided. Drying gas of low-molecular silicone generated in a drying gas generation part is heated by a heater and thereafter supplied from a drying gas supply nozzle. The drying gas is supplied to the main surface of a substrate being pulled up from de-ionized water stored in a cleaning bath as a stream. Silicone contained in the drying gas is condensed on the surface of the substrate, substitutes for moisture, and thereafter vaporizes. Silicone is excellent in permeability·dryability, and hence can suppress formation of a water mark also on a substrate having a refined·complicated structure. Further, silicone applies no load to the environment, and hence increase of a cost required for the drying treatment can be suppressed without requiring specific treatment for disposal. |