http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11552199-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2bcaf91101a370a3d64e3190366357f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02197 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-945 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-94 |
| filingDate | 2019-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2023-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc32ecc1655d907374ee97720394e739 |
| publicationDate | 2023-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-11552199-B2 |
| titleOfInvention | High-voltage capacitor for integration into electrical power modules and a method for the manufacture of the same |
| abstract | A high-voltage capacitor for integration into electrical power modules has a silicon layer into which an arrangement of recesses is introduced on a front face. The front face with the recesses is coated with a dielectric layer or dielectric layer sequence, wherein the recesses are filled with an electrically conductive material. The silicon layer bears a contact metallisation on the front face and the rear face for purposes of making electrical contact with the capacitor. A layer of thermal SiO2 is formed between the silicon layer and the dielectric layer or layer sequence. The dielectric layer or layer sequence has a layer thickness of ≥1000 nm and is formed from a ferroelectric or anti-ferroelectric material. The proposed high-voltage capacitor features a high integration density with a high capacitance and good heat dissipation properties. |
| priorityDate | 2018-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.