| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2021-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8ca3b51a69410368d7f8ebc2af4ecca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c25903cd1f12912c8f0690fdc569efa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef8c2d5fa0a9202398ef4e70de65119a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c0c6b577206c73799a267bd2ff6bfed |
| publicationDate |
2022-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11527411-B2 |
| titleOfInvention |
Interconnect structure having a carbon-containing barrier layer |
| abstract |
An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a conductive plug over a substrate; a conductive feature over the conductive plug, wherein the conductive feature has a first sidewall, a second sidewall facing the first sidewall, and a bottom surface; and a carbon-containing barrier layer having a first portion along the first sidewall of the conductive feature, a second portion along the second sidewall of the conductive feature, and a third portion along the bottom surface of the conductive feature. |
| priorityDate |
2014-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |