| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bc5292a07e34d16eb1d033a16d3aec3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-543 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02631
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66742
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02488 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786 |
| filingDate |
2020-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c559f6930a760e776ba18a02c6d90a57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db81e9a79702129742c241690e1aeafc |
| publicationDate |
2022-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11522069-B2 |
| titleOfInvention |
Thin-film semiconductors |
| abstract |
Systems and methods disclosed and contemplated herein relate to manufacturing thin film semiconductors. Resulting thin film semiconductors are particularly suited for applications such as flexible optoelectronics and photovoltaic devices. Broadly, methods and techniques disclosed herein include high-temperature deposition techniques combined with lift-off in aqueous environments. These methods and techniques can be utilized to incorporate thin film semiconductors into substrates that have limited temperature tolerances. |
| priorityDate |
2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |