Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c943ee5f76f0b8cdffeb12667b59f37e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14698 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14632 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
filingDate |
2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_286d9f41ed30a8b5066d2f541d095d26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1046eb253ffecea2f1eaa05e6168bb58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_efa0f86acd37cd2f70b2aed83c4e343a |
publicationDate |
2022-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11450697-B2 |
titleOfInvention |
Chip package with substrate having first opening surrounded by second opening and method for forming the same |
abstract |
A chip package including a substrate, a first conductive structure, and an electrical isolation structure is provided. The substrate has a first surface and a second surface opposite the first surface), and includes a first opening and a second opening surrounding the first opening. The substrate includes a sensor device adjacent to the first surface. A first conductive structure includes a first conductive portion in the first opening of the substrate, and a second conductive portion over the second surface of the substrate. An electrical isolation structure includes a first isolation portion in the second opening of the substrate, and a second isolation portion extending from the first isolation portion and between the second surface of the substrate and the second conductive portion. The first isolation portion surrounds the first conductive portion. |
priorityDate |
2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |