| abstract |
In one instance, a semiconductor package includes a lead frame and a semiconductor die mounted to the lead frame via a plurality of bumps that are shaped or tapered. Each of the plurality of bumps includes a first end connected to the semiconductor die and an opposing, second end connected to the lead frame. The first end has an end surface area A 1 . The second end has an end surface area A 2 . The end surface area A 1 of the first end is less than the end surface area A 2 of the second end. Other aspects are disclosed. |