http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11407225-B2
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7a38b8f31c86821e3d33abea457d095 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2202-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1433 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14112 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14129 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-17503 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-14088 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-14 |
filingDate | 2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2022-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4be570008313b0038ec277ce0d255ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a48620d3271f8c6e53f771b6d81dcdff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aecdb3a2159bf4871a114d08726481ad |
publicationDate | 2022-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-11407225-B2 |
titleOfInvention | Inkjet chip and thermal bubble inkjet printhead using the same |
abstract | An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided. |
priorityDate | 2020-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.