http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11369043-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20854 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0052 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-04 |
| filingDate | 2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d27b557e84a5dea59680610efb04140c |
| publicationDate | 2022-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-11369043-B2 |
| titleOfInvention | Board housing case |
| abstract | A heat generating component is mounted on a circuit board housed and fixed in a case including a base and a cover. Heat generated from the circuit board is transferred from a back surface of the circuit board via an insulating sheet to a heat transfer base portion formed on an inner surface of the base. Protruding portions configured to press the circuit board through elastic bodies are formed on an inner surface of the cover. When a peripheral portion of the circuit board is in pressure contact with and sandwiched between base-side and cover-side hold portions, curvature deformation of the peripheral portion of the circuit board occurs in a downward direction. Before start of the curvature deformation, the elastic bodies are brought into abutment against a front surface of the circuit board to suppress a reduction in pressure contact force on the insulating sheet. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022394881-A1 |
| priorityDate | 2018-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.