| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14ba71eccbb5f65a22b78f39b3c6ffc3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48479
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R2201-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00198
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0021 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 |
| filingDate |
2020-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e847c2c07e38ed7372c01e09c71ca53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9404a60b3e95f00f111e1d96e40e6efc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_454f94435deb14bd8eaf4237d55b4ba6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e47081739918789cf29321c894938b6c |
| publicationDate |
2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11358862-B2 |
| titleOfInvention |
Micro-electro-mechanical device having two buried cavities and manufacturing process thereof |
| abstract |
A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap. |
| priorityDate |
2018-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |