| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17cc2e143e369f78bc7ac4166c326752 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3752
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-0838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0218 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375 |
| filingDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_591a72b8661e8944d7dead4a93855ec6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_355468ead8b66c51329260a82a9ef477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d3bab1d409e897c84d048d055e8126b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7da2061d31cb52b83dc2da02b6257821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7595304a86e0f35c6efa06dccec971d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd881ce42bc37d47d6879e7e04b84a37 |
| publicationDate |
2022-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11324944-B1 |
| titleOfInvention |
Flexible cable assembly for medical implantation |
| abstract |
An electrical cable assembly amenable to implantation into a body includes a flexible cable. The flexible cable includes a dielectric substrate, a conductor lead for conducting an electrical signal, a conductive barrier layer, and an overmold layer. The conductor lead is embedded within and surrounded by the dielectric substrate. The conductive barrier layer surrounds the dielectric substrate and encases the dielectric substrate and conductor lead in a cavity. The conductive barrier layer is a continuous material layer that is neither braided nor spiral wrapped and provides a hermetic barrier formed of a metallic or inorganic material. The overmold layer provides one or more of mechanical protection or strain relief to the conductive barrier layer. |
| priorityDate |
2019-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |