| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1879 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F7-081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F7-1804 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc71d96fcf35841dddb03db755c9bda7 |
| publicationDate |
2022-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11319334-B2 |
| titleOfInvention |
Site-selective metal plating onto a package dielectric |
| abstract |
An integrated circuit (IC) package comprising a substrate having a dielectric, a first structure over at least a portion of the dielectric, the first structure comprising a molecular compound having a ligand coordinating moiety and a second structure over at least a portion of the first structure, the second structure comprising a metal, wherein the first structure is chemically bonded to the dielectric. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11621190-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021287936-A1 |
| priorityDate |
2017-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |