Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
filingDate |
2019-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fe453e80df6ef254456f0c8ef0a7c8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b69846e689266d71d907d913b33258b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_578cc5a90a77c57eef8eb513ff3da210 |
publicationDate |
2022-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11304309-B2 |
titleOfInvention |
Printed circuit board and method for manufacturing printed circuit board |
abstract |
A printed circuit board according to an embodiment of the present disclosure includes a base film having an insulating property, and a conductive pattern that is stacked on at least one surface of the base film and that includes a plurality of wiring parts arranged in parallel. The plurality of wiring parts have an average width of 5 μm or more and 15 μm or less. The plurality of wiring parts have an electroless plating layer and an electroplating layer stacked on the electroless plating layer. A void density at an interface between the electroless plating layer and the electroplating layer in a section of the plurality of wiring parts in a thickness direction is 0.01 μm2/μm or less. |
priorityDate |
2018-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |