| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate |
2020-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8135a22723afa1a02de077c27b4d2947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad9d6d656af4a74d96f76b334af96f4b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_add130174ecbf8d11a43e97eb792d9a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6f9642282779b1182d33b606f9c4609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2e8cd16029326842f837b3405447d47 |
| publicationDate |
2022-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11293091-B2 |
| titleOfInvention |
Substrate processing apparatus |
| abstract |
A substrate processing apparatus including a chamber accommodating a substrate; a substrate support in the chamber, the substrate support supporting the substrate; a gas injector to inject an oxidizing gas for oxidizing a metal layer to be disposed on the substrate; a cooler under the substrate to cool the substrate; a target mount disposed on the substrate, the target mount including a target for performing a sputtering process; and a blocker between the target and the gas injector, the blocker shielding the target from the oxidizing gas injected from the gas injector. |
| priorityDate |
2016-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |