| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1808
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-28 |
| filingDate |
2020-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e0256dbe31a7db90a70f7af881160b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4ea1ce2d1016ce4391885a89b0c5698
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b206f99362bcc219702553e06e0d779 |
| publicationDate |
2022-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11286370-B2 |
| titleOfInvention |
Solvent-free acrylic resin composition, solvent-free acrylic adhesive using same, adhesive sheet, and production method for solvent-free acrylic resin composition |
| abstract |
A solvent-free acrylic resin composition includes an acrylic resin (A), wherein the acrylic resin (A) contains 5 wt. % to 60 wt. % of a structural moiety derived from a hydroxy group-containing monomer (a1), and an acid value in the resin composition is from 0.001 mgKOH/g to 0.3 mgKOH/g. The solvent-free acrylic resin composition is suppressed in viscosity rise due to heating, and is hence excellent in thermal stability; the composition can be thickly applied when used as an adhesive; and the composition can provide an adhesive excellent in step followability, corrosion resistance, and moist-heat haze resistance. |
| priorityDate |
2017-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |