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filingDate 2020-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_573aeecd7b98dbd4de4ad04458798264
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publicationDate 2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11276643-B2
titleOfInvention Semiconductor device with backside spacer and methods of forming the same
abstract Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises a dielectric layer formed over a power rail; a bottom semiconductor layer formed over the dielectric layer; a backside spacer formed along a sidewall of the bottom semiconductor layer; a conductive feature contacting a sidewall of the dielectric layer and a sidewall of the backside spacer; channel semiconductor layers over the bottom semiconductor layer, wherein the channel semiconductor layers are stacked up and separated from each other; a metal gate structure wrapping each of the channel semiconductor layers; and an epitaxial source/drain (S/D) feature contacting a sidewall of each of the channel semiconductor layers, wherein the epitaxial S/D feature contacts the conductive feature, and the conductive feature contacts the power rail.
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