| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1858
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1658 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 |
| filingDate |
2017-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ea2288d8daf8ce29f75f403509c8372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9194bdfff63eae6e51b341039bdc98d |
| publicationDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11274375-B2 |
| titleOfInvention |
Tin plating bath and a method for depositing tin or tin alloy onto a surface of a substrate |
| abstract |
The present invention concerns a tin plating bath comprising tin ions; at least one complexing agent selected from the group consisting of pyrophosphate ions, linear polyphosphate ions and cyclic polyphosphate ions and a nitrogen and sulfur containing stabilizing additive and titanium (III) ions as a reducing agent suitable to reduce tin ions to metallic tin. The present invention further discloses a method of depositing tin or a tin alloy onto a surface of a substrate. The tin plating bath is particularly suitable to be used in the electronics and semiconductor industry. |
| priorityDate |
2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |