| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ec720220642342d345d2f8c4fe31503 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0522 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G9-0821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03G9-087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-188 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
2019-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15e7612e8957efac1c86a12309b09c41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07b5a7e4c709bb3d44aa41c34a243565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d234985f1ce6d3deaf232f130e163fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52ca7d820b67544fa267dd42bb16e4ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9e09a39600caac28653361fcbe31c23 |
| publicationDate |
2022-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11272622-B2 |
| titleOfInvention |
Method for producing circuit board and method for producing integrated circuit including the same |
| abstract |
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil. |
| priorityDate |
2018-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |