| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12d24c0a12c3ecdb6d9a47d623d96e76 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
| filingDate |
2020-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bdb1250c0a3e544349f3fe3ed729446 |
| publicationDate |
2022-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11251101-B2 |
| titleOfInvention |
Semiconductor device |
| abstract |
A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board. |
| priorityDate |
2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |