| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8ca78769cfc81fb517b8001d9b87c661 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-2293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N30-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-16 |
| filingDate |
2018-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02670336a2fd209db9d2560a9d6ed390
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_26d5f33f5da6a08c8e35ada8e8bcef9e |
| publicationDate |
2022-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11221263-B2 |
| titleOfInvention |
Microelectromechanical force sensor having a strain transfer layer arranged on the sensor die |
| abstract |
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including a sensor die and a strain transfer layer. The MEMS force sensor employs piezoresistive or piezoelectric strain gauges for strain sensing where the strain is transferred through the strain transfer layer, which is disposed on the top or bottom side of the sensor die. In the case of the top side strain transfer layer, the MEMS force sensor includes mechanical anchors. In the case of the bottom side strain transfer layer, the protection layer is added on the top side of the sensor die for bond wire protection. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023251146-A1 |
| priorityDate |
2017-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |