| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f502a56e30a1304f3c277c18b36165b9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-09181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82031 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-762 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 |
| filingDate |
2019-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9774b7d94e9336092bbdca63698b35e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3397fd696be20e2e8ebcc816ea0d014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4009c699c410fe05d3312feed69d8ce1 |
| publicationDate |
2021-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11164840-B2 |
| titleOfInvention |
Chip interconnection structure, wafer interconnection structure and method for manufacturing the same |
| abstract |
A chip structure, a wafer structure and a method for manufacturing the same are provided in the present disclosure. A first chip and a second chip are bonded by bonding layers of a dielectric material. Top wiring layers are led out through bonding via holes from a back surface of a bonded chip. The bonding via holes are used for bonding and are surrounded by the bonding layers. A top wiring layer of a third chip is led out through bonding pads formed in a bonding layer. The bonding via holes are aligned with and bonded to the bonding pads to achieve bonding of the three chips. The top wiring layer of the third chip is led out from the back surface of the third chip through a lead-out pad. |
| priorityDate |
2019-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |