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filingDate 2019-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bab8b7b8dfefc11b56b4ba56a0a288c3
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publicationDate 2021-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11107507-B2
titleOfInvention Transmitting data signals on separate layers of a memory module, and related methods, systems and apparatuses
abstract Systems, apparatuses, and methods for routing and transmitting signals in an electronic device are described. Various signal paths may be routed to avoid or limit reference transitions or transitions between layers of a structure of a device (e.g., printed circuit board (PCB)). In a memory module, for example, different data inputs/outputs (e.g., DQs) may be routed through different layers of a PCB according to their relative location to one another. For instance, DQs associated with even bits of a byte may be routed on one layer of a PCB near one ground plane, and DQs associated with odd bits of the byte may be routed on a different layer of the PCB near another ground plane. Each of the DQs may be subject to a single reference layer change, which may occur at or near a DRAM of a memory module (e.g., in the DRAM ball grid array (BGA) area).
priorityDate 2019-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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