Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa0f2776bcc27d5099aa97f3212e1681 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-86 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
filingDate |
2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f51b957ee801d6d5d05816bf275894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c29f453808fe9a6e10cd2122be801a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e20bfd942c06a7fc20b166dff3b88c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85d268d9cfba2bd9e77d4e101bb8d0d9 |
publicationDate |
2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11101151-B2 |
titleOfInvention |
Package substrate processing method |
abstract |
A package substrate processing method for processing a package substrate having a division line, an electrode being formed on the division line includes a cutting step of cutting the package substrate along the division line by using a cutting blade and a burr removing step of removing burrs produced from the electrode in the cutting step by spraying a fluid to the package substrate along the division line after performing the cutting step. The cutting step includes a step of supplying a cutting liquid containing an organic acid and an oxidizing agent to a cutting area where the package substrate is to be cut by the cutting blade. |
priorityDate |
2018-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |