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filingDate 2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f51b957ee801d6d5d05816bf275894
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publicationDate 2021-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11101151-B2
titleOfInvention Package substrate processing method
abstract A package substrate processing method for processing a package substrate having a division line, an electrode being formed on the division line includes a cutting step of cutting the package substrate along the division line by using a cutting blade and a burr removing step of removing burrs produced from the electrode in the cutting step by spraying a fluid to the package substrate along the division line after performing the cutting step. The cutting step includes a step of supplying a cutting liquid containing an organic acid and an oxidizing agent to a cutting area where the package substrate is to be cut by the cutting blade.
priorityDate 2018-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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